1366 Technologies nets $15 mln in Series C funds
1366 Technologies said Tuesday that it has raised $15 million in Series C funding. Tokuyama Corp. was the lead investor. Return backers North Bridge Venture Partners, Polaris Venture Partners, VantagePoint Capital Partners and Energy Technology Ventures also participated in the round. Based in Bedford, Mass., 1366 Technologies is a maker of silicon wafers.
15 October 2013•3 mins read
