Wireless Glue Networks Adds $4.5M in Financing
Wireless Glue Networks Inc. raised $4.5 million in a Series B financing. Investors include Japanese firms, Innovation Network Corporation of Japan, Toko Electric Corporation, Hosiden Corporation, and Clean Pacific Ventures. Wireless Glue Networks makes software to capture and deliver energy data in real-time for the Commercial and Industrial market.
22 February 2013•2 mins read
