Fintech platform Overbond closes $7.5 mln seed-stage round
Overbond Ltd, a Toronto-based bond issuance platform, has raised $7.5 million in seed-stage financing. The investment was made by Morrison Financial Services Ltd. Founded last year by CEO Vuk Magdelinic and Head of Product Han Ryoo, Overbond has developed technology to help digitalize bond issuance, connect market participants, and make transactions more transparent and secure. Earlier in 2016, the company unveiled Overbond BPS, a cloud-based solution for streamlining dealer-issuer communication and providing advanced market analytics.
16 June 2016•2 mins read
